Metallization on Ta(N) barrier layer with wet activation for electroless copper deposition
碩士 === 國立清華大學 === 材料科學工程學系 === 89 ===
Main Authors: | Ching-Wei Teng, 鄧經緯 |
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Other Authors: | Su-Jien Lin |
Format: | Others |
Language: | zh-TW |
Published: |
2001
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Online Access: | http://ndltd.ncl.edu.tw/handle/71613733825291151426 |
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