Metallization on Ta(N) barrier layer with wet activation for electroless copper deposition

碩士 === 國立清華大學 === 材料科學工程學系 === 89 ===

Bibliographic Details
Main Authors: Ching-Wei Teng, 鄧經緯
Other Authors: Su-Jien Lin
Format: Others
Language:zh-TW
Published: 2001
Online Access:http://ndltd.ncl.edu.tw/handle/71613733825291151426

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