Study on Integration of SAW Devices and IC

• Main Authors: ChunYen Chi, 季君炎
• Other Authors: Chang Pei-Zen
• Format: Others
• Language: zh-TW
• Published: 2001
• Online Access: http://ndltd.ncl.edu.tw/handle/50675570553414398890

碩士 === 國立臺灣大學 === 應用力學研究所 === 89 === Nowadays, SoC (system on a chip) is a very popular and widely accepted concept in the industry, due to the advantage of small size and low manufacturing cost. To integrate the SAW devices (surface acoustic wave devices) and IC (integrated circuit) on a single chip has an excellent prospect on a variety of application areas, especially now mass production and low cost are many people’s concerns. But it will be even more attractive if it can collaborate with the standard IC process. During the development of IC, IC foundries begin to grow with their professional techniques and high yield rate, this makes the independence of IC design and manufacture a definite trend. This research is expected to demonstrate the integration of SAW and IC that made from CMOS standard manufacturing process, The techniques used here include electroplating and heating-press bonding, etc. However, SAW requires piezoelectric substrate which IC chips do not possess. Therefore ZnO (Zinc Oxide) sputtered thin film is used to substitute the piezoelectric substrate.