Investigation of Quad Flat Non-lead Package For Radio-Frequency Applications

• Main Authors: Nansen Chen, 陳南璋
• Other Authors: 陳啟鏘
• Format: Others
• Language: en_US
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/33389712156871337654

碩士 === 逢甲大學 === 資訊工程學系 === 90 === The quad flat non-lead (QFN) package is a near chip scale package (CSP) and plastic encapsulated package with a coppery leadframe substrate. The purpose of this paper was to establish the wideband equivalent circuit model of QFN packages for RF applications. Only short-path configuration was required for S-parameter measurement to achieve this purpose. Comparison of S11 and S21 between S-parameter measurement and optimized equivalent circuit model verified that those results were well matched and optimized. The parasitic parameters of equivalent circuit were reliable up to 6 GHz. The methods proposed in this paper reduce the cost for samples preparation and chip simulation run time. In order to realize the package performance for higher frequency applications further, a 3D structure electromagnetic field simulator, HFSS, was used to simulate from 0.1 to 20 GHz for five modified package structures. Simulation results indicated that the QFN32 package utilized the double bonding wires with lower dielectric constant of molding compound and larger die-pad is the best structure for RF applications.