Investigation of Quad Flat Non-lead Package For Radio-Frequency Applications
碩士 === 逢甲大學 === 資訊工程學系 === 90 === The quad flat non-lead (QFN) package is a near chip scale package (CSP) and plastic encapsulated package with a coppery leadframe substrate. The purpose of this paper was to establish the wideband equivalent circuit model of QFN packages for RF applications. Only...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/33389712156871337654 |