Design and Analysis of Coplanar Waveguide Transmission Line

• Main Authors: Wei-chuan, Chiou, 邱文全
• Other Authors: Fu-shin Lee
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/40938893039393046341

碩士 === 華梵大學 === 機電工程研究所 === 90 === In this proposal, an equivalent circuit model will be established to design flip-chip high frequency transmission line structure based upon the principle of electromagnetic filed transmission line as well as electromagnetic interference phenomenon. The flip-chip structure is composed of coplanar waveguide ( CPW ) on the lower surface of the chip, the CPW on the upper surface of the substrate, and underfill resin for releasing thermal stress. The EMI phenomenon to be discussed are reflection due to encountering interconnection as high frequency signal transmitting from one CPW to another CPW, the resonant modes between chip surface and substrates causing degradation of isolation, and the influence on electric characteristics of the flip-chip structure due to underfill. The first stage of the proposed research is modeling and simulation based upon a electromagnetic field analysis software, then an equivalent model is established according to the calculated results for the flip-chip structure. Based upon the predictions, the final stage is to implement the design methodology to obtain a low EMI Flip-chip structure and conduct experiment measurement for the low EMI system. Therefore, the model can be modified and prediction of electric characteristics can be confirmed and automated. In summary, the objective of this research is to develop the technology for designing flip-chip mechatronic system, which is composed of high frequency flip-chip structure with low EMI problem, and therefore promote the domestic packaging industry.