| Summary: | 碩士 === 國立中興大學 === 機械工程學系 === 90 === ABSTRACT
This paper uses finite element analysis software to analyze the hinge structure of notebook computer. Herein, we intend to determine the reaction forces at hinge which are fixed with screws. The resultant reaction forces are then applied to I/O bracket as external forces. The I/O bracket stress analysis can then be obtained. The results show that the location of maximum stress coincident with the place of real failure. The shock-absorbing pad and screwed hinged are proposed to modify the hinge structure. The paper has solved real problem in a notebook computer, and then provides a systematic procedure for hinge structure analysis of notebook computer. It also provides a reference for production design and improving product for designing new type of hinge for notebook computer. These analysis experiences may also apply to personal digital assistant (PDA), electrical translator, personal cellular phone, and etc. Especially, while the popular cellular phone recently has become lighter, and smaller, therefore the design and development of associated hinge structure must be more delicate and precise in order to stay current and upgrade in the future.
Key words：Hinge, Notebook Computers, ANSYS, Stress Analysis
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