| Summary: | 碩士 === 國立交通大學 === 工業工程與管理學程碩士班 === 90 === The main purpose of semi-conductor packaging process is to ensure workable functionality and protect IC (Integrated Circuit) chip by connecting the electrical circuits of IC chip with external lead frame and injecting the molding compound. In packaging process, the operation of wire bonding is to link the internal/external electrical circuits between IC chip and lead frame. The bonding wire is possibly be broken or damaged during the following molding process if the wire strength is not strong enough. Furthermore, this defect will cause reliability concern in back-end PCB assembly process. Such defect of weak wire strength is not only damaged the quality image of packaging manufacturer, but also customers raised claim on this defect sometimes. Moreover, the afterward business orders will be deducted or cancelled.
The firm applied Taguchi’s approach to the wire bonding process, so as to improve the wire strength in short time. The quality characteristic was decided as reading value by “Wire Pull Test”. The study was also analyzed along with appropriate orthogonal arrays to accelerate and simplify the process of experiment. Based on Larger-The-Better, Signal-to-Noise ratio (SN ratio) data to analyze, the result shows the method result in the optimal parameter design. Furthermore, the additive model is appropriate in the experiment by means of confirmation experiment. The proposed optimal conditions do improve the wire strength of wire bonding process.
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