Application of Taguchi Methods to Improve the Semi-conductor Packaging Process - A Case Study for Wire Strength Optimization of Wire Bonding Process
碩士 === 國立交通大學 === 工業工程與管理學程碩士班 === 90 === The main purpose of semi-conductor packaging process is to ensure workable functionality and protect IC (Integrated Circuit) chip by connecting the electrical circuits of IC chip with external lead frame and injecting the molding compound. In packaging proce...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19348131731722772210 |