半導體廠商的競爭策略與核心優勢研究
碩士 === 國立臺灣大學 === 國際企業學研究所 === 90 === Abstract By end 2001, with a worldwide market share close to 80%, TSMC(Taiwan Semiconductor Manufacturing Corp) and UMC (United Manufacturing Corp) have unquestionably become the global wafer foundry leaders. Through defining the game rules and contin...
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ndltd-TW-090NTU003200012015-10-13T14:38:18Z http://ndltd.ncl.edu.tw/handle/99843225529119362312 半導體廠商的競爭策略與核心優勢研究 楊明炯 碩士 國立臺灣大學 國際企業學研究所 90 Abstract By end 2001, with a worldwide market share close to 80%, TSMC(Taiwan Semiconductor Manufacturing Corp) and UMC (United Manufacturing Corp) have unquestionably become the global wafer foundry leaders. Through defining the game rules and continuously developing most advanced sub-micorn process technologies, the big-2 has cultivated and stimulated the fast growth of IC design industry. Thanks to successful cut-in strategies, Taiwanese IC Design Houses like VIA, Sunplus and MediaTech have been enjoying the sweet results of IPO gains from market capitalization. However, in pursuance for further growth, diversifications seem to be the best way out for Taiwanese IC Design Houses. In order to compete with IDMs, IC design Houses must equip themselves with necessary survival skills. To clearly identify the core competence of Semiconductor Manufacturers (including IC Design Houses), how to reinforce the existing and develop the non-existing competitive edges will be the main focuses of this thesis. Apart from adopting Michael Porter’s theoretical competitive structure to analyze and locate the genuine core competence, special research efforts on Industrial Cluster effects and Intellectual Property (IP) have also been intensively carried out. The research shows that, out of the 12 critical success factors (CSF) for wafer foundry industry, item c, advanced process technology and mass production capability and item i, capability to define and develop process technology roadmap are the most important ones. The big-2 has not only fully taken the advantages and enlarged the leading gap, also dominated the market through “Differentiation” strategy. Three factors are considered most crucial for IC design Houses. Item 4, Establish market alliances with industrial leaders plus marketing/sales capability, item 5, own high market-valued IP rights, item 6, Ability to set industrial or market standards. Non-the-less, Taiwanese IC Design Houses are still lagging behind those US ones in above 3 aspects. The last part of the thesis focus on analyzing core competence of wafer foundries and IC Design Houses so as to come up with most appropriate competitive strategies, especially when confronting IDMs on global stages. Given the above facts, I truly believe the conclusions and suggestions in this thesis will be beneficial for both wafer foundries as well as IC design Houses, especially in making tough business decisions and strategies for the future. 吳青松 2002 學位論文 ; thesis 114 zh-TW |
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碩士 === 國立臺灣大學 === 國際企業學研究所 === 90 === Abstract
By end 2001, with a worldwide market share close to 80%, TSMC(Taiwan Semiconductor Manufacturing Corp) and UMC (United Manufacturing Corp) have unquestionably become the global wafer foundry leaders. Through defining the game rules and continuously developing most advanced sub-micorn process technologies, the big-2 has cultivated and stimulated the fast growth of IC design industry. Thanks to successful cut-in strategies, Taiwanese IC Design Houses like VIA, Sunplus and MediaTech have been enjoying the sweet results of IPO gains from market capitalization. However, in pursuance for further growth, diversifications seem to be the best way out for Taiwanese IC Design Houses. In order to compete with IDMs, IC design Houses must equip themselves with necessary survival skills.
To clearly identify the core competence of Semiconductor Manufacturers (including IC Design Houses), how to reinforce the existing and develop the non-existing competitive edges will be the main focuses of this thesis. Apart from adopting Michael Porter’s theoretical competitive structure to analyze and locate the genuine core competence, special research efforts on Industrial Cluster effects and Intellectual Property (IP) have also been intensively carried out.
The research shows that, out of the 12 critical success factors (CSF) for wafer foundry industry, item c, advanced process technology and mass production capability and item i, capability to define and develop process technology roadmap are the most important ones. The big-2 has not only fully taken the advantages and enlarged the leading gap, also dominated the market through “Differentiation” strategy. Three factors are considered most crucial for IC design Houses. Item 4, Establish market alliances with industrial leaders plus marketing/sales capability, item 5, own high market-valued IP rights, item 6, Ability to set industrial or market standards. Non-the-less, Taiwanese IC Design Houses are still lagging behind those US ones in above 3 aspects.
The last part of the thesis focus on analyzing core competence of wafer foundries and IC Design Houses so as to come up with most appropriate competitive strategies, especially when confronting IDMs on global stages. Given the above facts, I truly believe the conclusions and suggestions in this thesis will be beneficial for both wafer foundries as well as IC design Houses, especially in making tough business decisions and strategies for the future.
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吳青松 |
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吳青松 楊明炯 |
author |
楊明炯 |
spellingShingle |
楊明炯 半導體廠商的競爭策略與核心優勢研究 |
author_sort |
楊明炯 |
title |
半導體廠商的競爭策略與核心優勢研究 |
title_short |
半導體廠商的競爭策略與核心優勢研究 |
title_full |
半導體廠商的競爭策略與核心優勢研究 |
title_fullStr |
半導體廠商的競爭策略與核心優勢研究 |
title_full_unstemmed |
半導體廠商的競爭策略與核心優勢研究 |
title_sort |
半導體廠商的競爭策略與核心優勢研究 |
publishDate |
2002 |
url |
http://ndltd.ncl.edu.tw/handle/99843225529119362312 |
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