The application of photo dielectric material on high density printed circuit board
碩士 === 中國文化大學 === 材料科學與製造研究所 === 90 === The study of Photo Dielectric Material (ViaLuxTM81, Du pont ) applied on the high density printed circuit board. In the experiment which is getting the optimum operation for 4 mil photo dielectric via on the Build-up substrate by Taguchi.Four operation paramet...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/80940312592026283487 |
| Summary: | 碩士 === 中國文化大學 === 材料科學與製造研究所 === 90 === The study of Photo Dielectric Material (ViaLuxTM81, Du pont ) applied on the high density printed circuit board. In the experiment which is getting the optimum operation for 4 mil photo dielectric via on the Build-up substrate by Taguchi.Four operation parameters which are the exposure, the temperature of post bake , the time of post bake and the time of development.
Analyzing the structure of 4 mil photo dielectric via by O.G.P and microscopy.Getting the best operation parameters of 4 mil photo dielectric via analyzing by different vias.Analyzing the photo dielectric material of ViaLuxTM81 by using the MDSC.
We analyzed the photo dielectric under the different exposure by MDSC. Studying the effect of the reaction of photolytic of the photo dielectric. Then analyzing of the different temperature of post bake photo dielectric by MDSC. Studying the effect of thermal of photo dielectric.
The adhesion of photo dielectric was not well. Using the PTFE for the dielectric material. Then using the RF plasma to increase the hydrophilic of the PTFE. Analyzing the surface of the PTFE by ESCA.
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