Integration of Taguchi Method and Artificial Neural Network for Determining Optimal Solder-paste Printing Process Parameters at SMT line

碩士 === 國立臺北科技大學 === 生產系統工程與管理研究所 === 90 === The solder printing is the crucial process at the SMT line in the PC main logic board assembly factory. A deficient solder printing may result in the defective solder joint between the chip’s lead and solder pad (or print foot) over the PCB. Variable and...

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Bibliographic Details
Main Authors: Lin, Terng, 林籐
Other Authors: R.J. Kuo
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/35401121488652739720

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