Integration of Taguchi Method and Artificial Neural Network for Determining Optimal Solder-paste Printing Process Parameters at SMT line
碩士 === 國立臺北科技大學 === 生產系統工程與管理研究所 === 90 === The solder printing is the crucial process at the SMT line in the PC main logic board assembly factory. A deficient solder printing may result in the defective solder joint between the chip’s lead and solder pad (or print foot) over the PCB. Variable and...
Main Authors: | Lin, Terng, 林籐 |
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Other Authors: | R.J. Kuo |
Format: | Others |
Language: | zh-TW |
Published: |
2003
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Online Access: | http://ndltd.ncl.edu.tw/handle/35401121488652739720 |
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