Effect of Curing Temperature on Properties, Solvent Welding and Microforming of Hybrid-albumen

• Main Authors: Yi-chuan Lin, 林益全
• Other Authors: Chin-Bin Lin
• Format: Others
• Language: zh-TW
• Published: 2002
• Online Access: http://ndltd.ncl.edu.tw/handle/99890127190377465106

碩士 === 淡江大學 === 機械工程學系 === 90 === This paper discussed the effect of curing temperature (90℃, 120℃, 150℃) on tensile, three point bending, hardness, and spectrum analysis of homogenized hybrid-ovalbumin liquor. Experimental results showed that the numbers of non-saturated free radicals at wavenumber of 3298cm-1 and 2965cm-1 increased as its curing temperature rose. The transmittance increases and adsorption decreases as the wavelength increases. There is an absorptive peak at 440~450nm and the wavelength of the absorptive peak increases while the curing temperature rises. For the tensile properties, yield strength, ultimate tensile strength and Young’s modulus rises with apparent phenomenon of manufacturing hardening. Tensile fracture morphology possesses the form between tough and brittle, brittle fracture morphology rises as the curing temperature rises. For the properties of three-point bending, its curve of bending history possesses three obvious stages. The butt and lap between two hybrid-ovalbumin liquor upon loading of 0.1kgf and 0.2kgf after welding by DI water also has been investigated. The samples were cured in air for 30 minutes at 90℃, 120℃ and 150℃ (±2℃). The results have comprehended the welding strength rose as curing temperature and loading increased. The recovery of welding strength is over than 100% at curing temperature 150℃. For butt, the fracture morphology of central zone forms the roving-like crosslinkage, and fracture morphology of outside zone possesses plastic break. The welding strength rose as the numbers central roving-like crosslinkage zone and plastic break of outside zone increased. For Lap, there was better welding strength when the fracture morphology was smooth, the plastic break morphology decreased as the curing temperature and loading rose. We fabricated the microstructure of albumen by hot-embossing process and silicon master. The result discovered the minimization and shrink age ratio of microstructure decreased as curing temperature rose. And numbers of micro-forming rose as curing temperature rose. For fracture morphology by demolding, some parts of microstructures were pulled out at curing temperature 90℃, the fracture morphology of microstructures possess tear at curing temperature 120℃, and the fracture morphology of the two extremities of microstructures possess brittle topography. The brittle fracture morphology was more obvious as curing temperature rose.