| Summary: | 碩士 === 中原大學 === 化學工程研究所 === 91 === 英文摘要
Organic dielectrics will play an important role in microelectronic industry, because they have good mechanical properties, high thermal stability and quite low dielectric constant.
In this study, a series of pyromellitic dianhydride based polyimides were prepared using four different kinds of diamines containing different alkyl sizes. Our results are shown that all of pyromellitic dianhydride based polyimides show good thermal stability (＞420℃), quite high glass transition temperature (＞340℃), good mechanical properties (Young modulus＞1 GPa), and good diffusion barrier to resist copper penetration. Therefore, they could have good opportunity to be used as inter-layer dielectrics in microelectronic process.
In addition, a low dielectric value (~3) can be reached by varying the size of alkyl group.
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