The study of pyromellitic dianhydride based polyimides for interlevel dielectrics
碩士 === 中原大學 === 化學工程研究所 === 91 === 英文摘要 Organic dielectrics will play an important role in microelectronic industry, because they have good mechanical properties, high thermal stability and quite low dielectric constant. In this study, a series of pyromellitic dianhydride based polyimides were p...
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ndltd-TW-091CYCU50630042015-10-13T16:56:48Z http://ndltd.ncl.edu.tw/handle/96015080315589208367 The study of pyromellitic dianhydride based polyimides for interlevel dielectrics 探討苯均四酸二酐系列之聚醯亞胺應用在積體電路製程的研究 Zheng-Jie Gao 高正杰 碩士 中原大學 化學工程研究所 91 英文摘要 Organic dielectrics will play an important role in microelectronic industry, because they have good mechanical properties, high thermal stability and quite low dielectric constant. In this study, a series of pyromellitic dianhydride based polyimides were prepared using four different kinds of diamines containing different alkyl sizes. Our results are shown that all of pyromellitic dianhydride based polyimides show good thermal stability (>420℃), quite high glass transition temperature (>340℃), good mechanical properties (Young modulus>1 GPa), and good diffusion barrier to resist copper penetration. Therefore, they could have good opportunity to be used as inter-layer dielectrics in microelectronic process. In addition, a low dielectric value (~3) can be reached by varying the size of alkyl group. Chun-Lin Cheng 鄭俊麟 2003 學位論文 ; thesis 77 zh-TW |
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碩士 === 中原大學 === 化學工程研究所 === 91 === 英文摘要
Organic dielectrics will play an important role in microelectronic industry, because they have good mechanical properties, high thermal stability and quite low dielectric constant.
In this study, a series of pyromellitic dianhydride based polyimides were prepared using four different kinds of diamines containing different alkyl sizes. Our results are shown that all of pyromellitic dianhydride based polyimides show good thermal stability (>420℃), quite high glass transition temperature (>340℃), good mechanical properties (Young modulus>1 GPa), and good diffusion barrier to resist copper penetration. Therefore, they could have good opportunity to be used as inter-layer dielectrics in microelectronic process.
In addition, a low dielectric value (~3) can be reached by varying the size of alkyl group.
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Chun-Lin Cheng |
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Chun-Lin Cheng Zheng-Jie Gao 高正杰 |
author |
Zheng-Jie Gao 高正杰 |
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Zheng-Jie Gao 高正杰 The study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
author_sort |
Zheng-Jie Gao |
title |
The study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
title_short |
The study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
title_full |
The study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
title_fullStr |
The study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
title_full_unstemmed |
The study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
title_sort |
study of pyromellitic dianhydride based polyimides for interlevel dielectrics |
publishDate |
2003 |
url |
http://ndltd.ncl.edu.tw/handle/96015080315589208367 |
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