| Summary: | 碩士 === 國立成功大學 === 工程科學系碩博士班 === 91 === Both Valanis and Lee to propose the theory of deformation kinetics in 1981, that decide deformation kinetics constitutive equation of solder materials (42Sn-58Bi, 96.5Sn-3.5Ag, 63Sn-37Pb, 95.5Sn-3.8Ag-0.7Cu) parameter when different temperature and stress affects of steady state creep rate data. In accordance with, this theory carcass proceed pull or twist stress steady state creep rates of mutual transformation, and confer deformation kinetics parameter with lead amount between 37% and 100% Sn/Pb solder of relationship.
Solders are estimated in anticreep ability. This text proceed estimate by both energy barrier gradient and a material internal displacement for homologous temperature (T/Tm) of sensitivity. This 63Sn-37Pb is compared model of this three kinds of lead free solders T/Tm between 0.5 and 0.9 anticreep ability in bulk specimen.While 42Sn-58Bi has similar anticreep ability to 63Sn-37Pb solder at room temperature(T/Tm about 0.5 to 0.6), it becomes lower anticreep ability as high temperature (T/Tm about 0.9). Both 95.5Sn-3.8Ag-0.7Cu and 96.5Sn-3.5Ag solders are uncertain anticreep ability to 63Sn-37Pb solder. Compare anticreep ability of 95.5Sn-3.8Ag-0.7Cu solder and 96.5Sn-3.5Ag solder, where join 0.7%Cu batter anticreep ability at T/Tm range between 0.5 and 0.9 . A result of the above-mentioned estimate tally with microstructuralfour of four kinds solder materials point of view.
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