Integrated solution for multi-stage wafer probing scheduling problem with reentry

• Main Authors: Kuan-Peng Hsiao, 蕭冠鵬
• Other Authors: Wen-Lea Pearn
• Format: Others
• Language: en_US
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/00392554818343846988

碩士 === 國立交通大學 === 工業工程與管理系 === 91 === The multi-stage wafer probing scheduling problem (M-WPSP) with reentry, is a practical variation of the parallel-machine scheduling problem. Since the M-WPSP involves multiple product families with various job due dates, ready times, reentry, serial and batch operations, sequential dependent setup time, it is more difficult to solve than the classical parallel machine scheduling problems. In this thesis, we consider two strategies to solve the M-WPSP, where the total machine workload must be minimized. The sequential strategy schedules the jobs at the required stages according to the sequence of manufacturing operations. The parallel strategy is designed specifically for the reentrant characteristic. In additional to this, we investigate five existing insertion procedures and develop three modified insertion procedures, which are used to implement the proposed strategies and solve the M-WPSP. To evaluate the efficiency of the proposed strategies, a set of test problems involving four critical factors: the product family ratio, the temperature-change consideration, tightness of due dates, and ready time are designed to test the quality of solutions under two different workload environments. To test the performance of five existing insertion procedures and three modified insertion procedures, another set of test problems, which also involve the critical factors, are provided and analyzed under a single stage environment.