Study of Multi-layer Miniaturized Directional Couplers Using Thin-film Fabrication

• Main Authors: MinFang Hsieh, 謝旻芳
• Other Authors: Chi-Yang Chang
• Format: Others
• Language: en_US
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/92434568501300995135

碩士 === 國立交通大學 === 電信工程系 === 91 === Multi-layer thin-film (MCM-D) technology is used in this thesis to develop various kinds of directional couplers. The circuit includes branch-line coupler, symmetrical multi-section broadband coupler, and rat-race ring coupler. Determination of the primordial and the thin-film multiplayer structures of the couplers will be studied in this thesis. The re-entrant structure for tight coupler and the improvement of directivity of the coupler will also be discussed. Finally, we will compare the circuit size between the interdigital coupler and the multi-layer thin-film coupler. The smaller size verifies the superiority of circuit miniaturization using multi-layer thin-film technology. All measurement results correlate well with simulated results.