| Summary: | 碩士 === 國立交通大學 === 電信工程系 === 91 === In this thesis, several RF key components have been designed and demonstrated in multi-layer structures such as the low-temperature cofired ceramic (LTCC) and the 96% Al2O3 substrate with surface naro-processing. First, the microstrip ring structure is used to find the electronic parameters of the LTCC. By comparing to the simulation and measurement results of a well-known substrate (RO 4003), the dielectric constant and loss tangent of the LTCC substrate are obtained. Next, transitions between LTCC microsrip line, stripline, and laminated waveguide at different layers are studied. Simulation and Measurement results show that good transition can be achieved by suitably designing the vias connecting the signal lines and those connecting the grounds. The third part of this thesis is to design a 5GHz balun in the thin-film substrate (Al2O3). The design is based on the lump element equivalent circuit of quarter-wave transmission line. Finally, this thesis design a LTCC lump-element three-order cross-coupling bandpass filter. The cross couplings give the signal two paths from input port to the output port, which cause transmission zeros at finite frequencies.
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