| Summary: | 碩士 === 國立清華大學 === 工業工程與工程管理學系 === 91 === Semiconductor technologies are rapidly developed. Those semiconductor companies, that provide the industry''s advanced process technology, work diligently on improving their process technology. With the improvement of technology, wafer testing is getting more and more important. At the beginning of new technologies, the yields are generally lower and unstable. Therefore, we need be able to perform wafer tests quickly and accurately to speed up the improvement of new technologies. After improving the processes, yields will gradually increase and become stable.
Because of the importance of wafer probe testing to semiconductor manufacturing, it becomes the focus of this research. However, semiconductor manufacturing has two kinds of test processes. One is wafer probing after wafer fabrication and the other one is final testing after device packaging. Our research focuses on the step of wafer probe testing and we would like to investigate how to complete customers’ orders on time and minimize the machine workload.
To solve this problem, we propose a new mixed integer program to model the problem and, then, solve the problem by standard algorithms or software packages. However, the size of a mathematical formulation（the number of rows and columns of the problem matrix） determines the computation time. This research proposes a new modeling method to generate formulation with less constraints and less variables in order to reduce the computation time. In our experiment, we will randomly generate different sizes of problems to verify the efficiency of our modeling method. The result of our experiment indeed shows that our modeling method is much more efficient.
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