Design,manufacture,simulation and test of burn-in socket for 3D MCM BGA packaging
碩士 === 國立清華大學 === 動力機械工程學系 === 91 ===
Main Author: | 蕭金首 |
---|---|
Other Authors: | 蕭德瑛 |
Format: | Others |
Language: | zh-TW |
Published: |
2003
|
Online Access: | http://ndltd.ncl.edu.tw/handle/05853249191128243361 |
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