Reaction Mechanism studies of Organic Additives on Copper Plating for IC substrate Micro Via-Hole Filling
碩士 === 國立雲林科技大學 === 工業化學與災害防治研究所 === 91 === Traditional process of wafer and IC packaging substrate manufacture has encountered severe challenge with modern electronic products becoming smaller and powerful. The most crucial challenge is the trenches and blind-via holes filled by copper plating. Thi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/85168126880669576802 |