微電鑄參數於U型陣列模仁之數值研究

• Main Authors: Jan Jian-Sheng, 詹健聖
• Other Authors: Chang Pai-Yu
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/96670815291430343671

碩士 === 國防大學中正理工學院 === 造船工程研究所 === 92 === The single hole and a mould of U-type array are mabe by the micro-electroforming . It’s products making shape can be applied extensively to need for the technology of batch-making biochip, analysis of micro-flows and fuel cell with a pair of the polar plate etc. The discussion of this article alleges that the physics behavior of micro-electroforming for a mould of the U-type array which compose of electrolyte (0.6 mol/liter CuSO4 and 1.85 mol/liter H2SO4) .It includes electrolyte fluid flow, mass transfer and electrolyte reaction on the anode-cathode of electrolyte. The mimic numerical method method can encompass to predict the analytic mould in the cathode-field for internal stress facility, shear and concentration distribution, and current density distribution. The result refers to the higher-surface accurate microstructure of higher hardness, lower residual stress and well-duplicated. Studying has three parts especially: The first part flows for main inside with the form single hole mould insert of the U-type field, shearing stress are distributed. The concentration distributing , voltage distributing and density of current. And different Pe value while changing different width of hole .As the width of the hole small convection effect the effect than the diffusion effect small. The convection effect is than the diffusion effect when the hole is great in width. And it is result of calculation and number value of Kondo have good consistency. The second part of regular U-type array mould insert appearances. Probe into the micro-electroforming and the parameter effect, change the concentration of anode surface, bulk voltage and Pe value. The third part: surface for the cathode’s geometry surface consisted different aspect ratio, distance between the mould cavities, distance between the resist mold and the extension-surface, and different cavities such as a U-type, a trapezoid or a circle cavity and rotation of cathode disk. To statistic and arrange, then can obtain optimum parameters, to match uniform internal stress distribution and current density distribution in the micro-electroforming process. Keywords：micro electroforming, U-type matrix mould insert, electrolyte, density of current, shear stress.