Study on the Thermosonic Wire Bonding Process and Bonding Mechanism for Chips with Copper Interconnects
博士 === 國立中正大學 === 機械系 === 92 === Abstract As semiconductor devices are reduced in scale, the dimension of interconnects shrinks to the sub-micron level. The resistance-capacitance (RC) time constant becomes a major part of total delay. In order to reduce the RC time constant, the chip wit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96205801478185877513 |