A Study of Effects of the Voids Formed by the Decomposition of the Flux for Lead-free Solder Package
碩士 === 國立中正大學 === 機械系 === 92 === The most important part of a package is the solder joints between the two electronic components and the Lead-free solder is the major concern for the environmental consideration now. Under the high melting temperature of the Lead-free solder, the flux tends to decomp...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/26555846031621548319 |