Real Time Wafer by Wafer control in CMP Systems
碩士 === 長庚大學 === 化工與材料工程研究所 === 92 === Chemical mechanical planarization(CMP) has become part of important processing module in semiconductor manufacturing due to the shallow trench isolation technique. It is known that many different sources of variations are commonly found in CMP process. Hence the...
Main Author: | 林宜弘 |
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Other Authors: | 王國彬 |
Format: | Others |
Language: | zh-TW |
Published: |
2004
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Online Access: | http://ndltd.ncl.edu.tw/handle/63105755744606959804 |
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