Study on Delamination of Bottom Paddles of Lead Frames for Semiconductor Packaging
碩士 === 國立成功大學 === 工程科學系專班 === 92 === This thesis were mainly researched to addressed the occurrence of delamination phenomenon between the interface of epoxy molding compound (EMC) and bottom paddle of the lead frame during assembly process. The said experiment was performed into two parts: One...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7kbnab |