Synthesis of low dielectric material-PPOresin for high frequency substrate application

碩士 === 國立成功大學 === 化學工程學系碩博士班 === 92 === Abstract Polyphenylene oxide(PPO) possesses excellent electrical properties(low dielectric constant and low dielectric loss factor) and thermal resistant , however owing to high molecular weight, its reactivity and process ability are very low for electronic a...

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Main Authors: Su-Wen Hsu, 許蘇文
Other Authors: Chun-Shan Wang
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/8d7j56
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spelling ndltd-TW-092NCKU50630132019-05-15T20:21:36Z http://ndltd.ncl.edu.tw/handle/8d7j56 Synthesis of low dielectric material-PPOresin for high frequency substrate application 高頻基板用低界電材料-PPO樹脂之合成 Su-Wen Hsu 許蘇文 碩士 國立成功大學 化學工程學系碩博士班 92 Abstract Polyphenylene oxide(PPO) possesses excellent electrical properties(low dielectric constant and low dielectric loss factor) and thermal resistant , however owing to high molecular weight, its reactivity and process ability are very low for electronic applications. This study uses small molecules to modify polyphenylene oxide(PPO). Modification can decrease molecular weight of PPO and incorporate a highly reactive end group. Small molecules containing various functional end group, such as double bond group、epoxy group and phenolic group are incorporated into PPO to improve the process ability and reactivity of PPO. MA-PPO and OL-PPO are prepared by molecular weight redistribution reaction between PPO and maleic anhydride or PPO and bisphenol A(BPA) in the presence of benzoyl peroxide(BPO) as free radical initiator. N-Cl-PPO is prepared by reaction between OL-PPO and N,N-diallyl-2-chloroacetamide in the presence of tetra-butylammonium hydrogen sulfate as phase transfer catalyst. E2-PPO and E4-PPO are prepared by reaction between OL-PPO and Bisphenol A epoxy(BPA Epoxy) or OL-PPO and 1,1,2,2-tetrakis(4-glycidyloxy -phenyl) ethane in the presence of tributylamine as catalyst. Curing of MA-PPO and N-Cl-PPO system are accomplished by copolymerization between MA-PPO and triallylisocyanurate(TAIC) or N-Cl-PPO and TAIC, however, due to poor mold ability. PS is added to improve the process ability. Curing of E2-PPO and E4-PPO system are accomplished by mixing E2-PPO and BPA Epoxy or E4-PPO and BPA Epoxy using DDM as curing agent. Glass transition temperature(Tg) and electrical properties(dielectric constant and dielectric loss factor) of those cured resins are compared with each other. Cured resins of MA-PPO and N-Cl-PPO systems have excellent thermal (Tg) and electrical properties, but these cured resins have poorer mold ability than those of E2-PPO and E4-PPO systems. Addition of Allyl-DOPO as phosphorus containing flame retardant has improved the flame retardancy of cured resins because of P-N synergism effect. UL-94-V0 rating can be achieved with a phosphorus content of as low as 1.35%,however, a detrimental effects on Tg and electric properties are observed. Chun-Shan Wang 王春山 2004 學位論文 ; thesis 109 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 化學工程學系碩博士班 === 92 === Abstract Polyphenylene oxide(PPO) possesses excellent electrical properties(low dielectric constant and low dielectric loss factor) and thermal resistant , however owing to high molecular weight, its reactivity and process ability are very low for electronic applications. This study uses small molecules to modify polyphenylene oxide(PPO). Modification can decrease molecular weight of PPO and incorporate a highly reactive end group. Small molecules containing various functional end group, such as double bond group、epoxy group and phenolic group are incorporated into PPO to improve the process ability and reactivity of PPO. MA-PPO and OL-PPO are prepared by molecular weight redistribution reaction between PPO and maleic anhydride or PPO and bisphenol A(BPA) in the presence of benzoyl peroxide(BPO) as free radical initiator. N-Cl-PPO is prepared by reaction between OL-PPO and N,N-diallyl-2-chloroacetamide in the presence of tetra-butylammonium hydrogen sulfate as phase transfer catalyst. E2-PPO and E4-PPO are prepared by reaction between OL-PPO and Bisphenol A epoxy(BPA Epoxy) or OL-PPO and 1,1,2,2-tetrakis(4-glycidyloxy -phenyl) ethane in the presence of tributylamine as catalyst. Curing of MA-PPO and N-Cl-PPO system are accomplished by copolymerization between MA-PPO and triallylisocyanurate(TAIC) or N-Cl-PPO and TAIC, however, due to poor mold ability. PS is added to improve the process ability. Curing of E2-PPO and E4-PPO system are accomplished by mixing E2-PPO and BPA Epoxy or E4-PPO and BPA Epoxy using DDM as curing agent. Glass transition temperature(Tg) and electrical properties(dielectric constant and dielectric loss factor) of those cured resins are compared with each other. Cured resins of MA-PPO and N-Cl-PPO systems have excellent thermal (Tg) and electrical properties, but these cured resins have poorer mold ability than those of E2-PPO and E4-PPO systems. Addition of Allyl-DOPO as phosphorus containing flame retardant has improved the flame retardancy of cured resins because of P-N synergism effect. UL-94-V0 rating can be achieved with a phosphorus content of as low as 1.35%,however, a detrimental effects on Tg and electric properties are observed.
author2 Chun-Shan Wang
author_facet Chun-Shan Wang
Su-Wen Hsu
許蘇文
author Su-Wen Hsu
許蘇文
spellingShingle Su-Wen Hsu
許蘇文
Synthesis of low dielectric material-PPOresin for high frequency substrate application
author_sort Su-Wen Hsu
title Synthesis of low dielectric material-PPOresin for high frequency substrate application
title_short Synthesis of low dielectric material-PPOresin for high frequency substrate application
title_full Synthesis of low dielectric material-PPOresin for high frequency substrate application
title_fullStr Synthesis of low dielectric material-PPOresin for high frequency substrate application
title_full_unstemmed Synthesis of low dielectric material-PPOresin for high frequency substrate application
title_sort synthesis of low dielectric material-pporesin for high frequency substrate application
publishDate 2004
url http://ndltd.ncl.edu.tw/handle/8d7j56
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