The Study of A Vapor Chamber Design for Electronics Cooling

• Main Authors: Chih-Jen Liu, 劉智仁
• Other Authors: Shih-Hsiung Chen
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/42639938648648863710

碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 92 === 　　The present study is to discuss the advantages of a vapor chamber on CPU cooling, utilizing its latent heat property in a two-phase flow environment. The vapor chamber is 60*60*5.5mm in dimension. A dummy heater is used to simulate a CPU heat source. The heat is removed by circulated water at the other side of the vapor chamber. Thermal performance of the vapor chamber is judged by the thermal resistance which is determined by the measured heater temperature and circulated cooling water temperature. The variations of chamber liquid volume, base groove structure, and circulated water quantity on the thermal performance are discussed. It is formed that when the chamber liquid volume exceeds certain theoretical value, its thermal resistance can be low at high heat condition. The cooling water quantity also has positive influence on the thermal resistance, especially when the chamber liquid volume is low. Moreover, the groove structure at the chamber base provides larger surface area and enhanced capillary force for better heat exchange.