| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 92 === This paper proposes a method which obtains mechanical properties of materials by scribing and breaking processes. This paper also analyzes the machining characteristics of brittle materials by these processes, and observed the scribing surface morphology by experimenting on different cutting traces and rake angles. The specific cutting energy of different materials such as silicon, optical glass, Cu2600 and Al6061 is discussed. Moreover, mechanical properties such as Young’s modulus, bending force and fracture toughness are calculated from breaking force.
The result of experiments shows that the cutting conditions will experience ductile, brittle–ductile transition and then brittle destruction when the cutting depth changes from shallow to deep. The deeper the cutting depth is, the less the specific cutting energy is. Finally, the process will be brittle or ductile process when the depth for silicon is more than 1mm or less than 0.4mm and it will be brittle or ductile process when the depth for STV-Glass is more than 2mm or less than 0.6mm.
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