Treatment of Chemical Mechanical Polishing Wastewater by Dead-end Microfiltration : Evaluation of Pretreatment Process and Their Effects
碩士 === 國立交通大學 === 環境工程系所 === 92 === Chemical mechanical polishing process is a common practice for wafer planarization of the IC manufacturing. In the process, colloidal silica is used to planarize the oxide wafer surface. In the mean time, a large amount of ultrapure water is used to clean the su...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/r7xytm |