A New Surface Finish for Solder Joints Exhibiting both Low Consumption Rate and Oxidation Resistance
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 92 === Solder joints are the most friable links in microelectronic devices. In fact, a failure in solder joints is the easiest root which would take the responsibility for malfunction in electronic products. Therefore, to improve the reliability of solder joints is...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72841748967225681766 |