Research on Planarization of Single Crystal Sapphire Wafers with Dry Mechano-Chemical Polishing
碩士 === 國立臺灣科技大學 === 機械工程系 === 92 === ABSTRACT This research is to develop a two-stage process model and to investigate effects of working parameters of the Dry Mechano-Chemical Polishing (DMCP) for single-crystal sapphire wafers with the SiO2 abrasives of average grit diameter 26 nm. The...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20692405599298206205 |