| Summary: | 碩士 === 東海大學 === 工業工程與經營資訊學系 === 92 === Recently, IC substrate industry grows rapidly due to the technology innovation of IC packaging industry. Therefore,most PCB and IC packaging companies have prepared for the investment of IC substrate manufacturing technology. The manufacturing process of IC substrate is similar to PCB, existing PCB related researches focus on PCB assembly and manufacturing technology, very few PCB scheduling related researches study capacity planning without considering complete production constraints and study production planning.
The objective of this research may be summarized as follows：
1.Develop a PCB industry production planning reference model
including: (1) manufacturing order planning ( PCB Lot
Planning；PLP ), (2) production scheduling, (3) order
fulfillment, and (4) performance indexes.
2.Focus on studying the PLP approach of production planning in
PCB industry, and illustrate it through a real case of a
Taiwan’s PCB manufacturer.
3.Develop the production scheduling logic of beginning test
part occurred in the photography and solder mask workstation.
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