| Summary: | 碩士 === 國立臺北科技大學 === 冷凍與低溫科技研究所 === 92 === This research uses a Thin Film Transistor Liquid Crystal Display (TFT-LCD）fabrication cleanroom as the subject of study. Airborne molecular contaminations (AMC) in actual operating conditions were measured for spatial distribution. Different measurement methods were used for different types of contaminants. Semiconductor Equipment and Materials International (SEMI）standards F21-95, F21-1102 were applied to analyze and classify the cleanroom according to the types and concentration of the contaminants. The results are for acids (Class MA) the cleanroom class is MA-1,000; for bases (Class MB) the cleanroom class is MB-10,000; for condensable organic compounds (Class MC) the cleanroom class is MC-10,000; and for trace metals (Class MD) the cleanroom class is MD-10,000.
On environmental health and safety, SEMI-S2 standard requires semiconductor fabrication tools to control the airborne concentration of the chemicals used to be under 1 % of occupation exposure level (OEL). Although TFT-LCD differs from semiconductor in manufacturing processes, but the front end array fabrication processes are similar to that of semi-conductor. Highly clean environments are required for the clean room work environment. The case studied here achieved the requirements of under 1 % of occupation exposure level (OEL).
Sources of all AMCs were identified to come from the effluents of chemicals used in fabrication processes and organic solvents for cleaning. Finally, improvement measures or emission control practices are analyzed and discussed for optimal future design, so to increase yield and to protect workers’ health.
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