Study of DLC Field Emission Device Fabricated by Thick-Film Technology
碩士 === 大同大學 === 光電工程研究所 === 92 === Our purpose is to deposit diamond-like carbon (DLC) films by reactive R.F. sputtering deposition, scrape the DLC films to be the DLC powder, and manufacture into DLC paste. In order to realize the fabricated possibility of large area field emission display on glass...
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ndltd-TW-092TTU001240022016-06-15T04:17:08Z http://ndltd.ncl.edu.tw/handle/46232304983880974693 Study of DLC Field Emission Device Fabricated by Thick-Film Technology 利用厚膜技術製作類鑽碳場發射元件之研究 Jian-Min Jeng 鄭健民 碩士 大同大學 光電工程研究所 92 Our purpose is to deposit diamond-like carbon (DLC) films by reactive R.F. sputtering deposition, scrape the DLC films to be the DLC powder, and manufacture into DLC paste. In order to realize the fabricated possibility of large area field emission display on glass substrate, we completed the field emission devices on glass substrates by thick film technique. When depositing DLC films, reactive gas CH4 and H2 were introduced to increase the surface roughness DLC films and reduce the adhesion between the DLC films and substrate. These results can improve the field emission properties and be easier to scrape the DLC films to be the DLC powder. We have manufactured the 21×21 emitter array successfully on cathode by DLC paste printing. The current density of emission site is 249.68μA/cm2 (at 12.22 V/μm). Jyi-Tsong Lo 羅吉宗 2004 學位論文 ; thesis 96 en_US |
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碩士 === 大同大學 === 光電工程研究所 === 92 === Our purpose is to deposit diamond-like carbon (DLC) films by reactive R.F. sputtering deposition, scrape the DLC films to be the DLC powder, and manufacture into DLC paste. In order to realize the fabricated possibility of large area field emission display on glass substrate, we completed the field emission devices on glass substrates by thick film technique. When depositing DLC films, reactive gas CH4 and H2 were introduced to increase the surface roughness DLC films and reduce the adhesion between the DLC films and substrate. These results can improve the field emission properties and be easier to scrape the DLC films to be the DLC powder. We have manufactured the 21×21 emitter array successfully on cathode by DLC paste printing. The current density of emission site is 249.68μA/cm2 (at 12.22 V/μm).
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author2 |
Jyi-Tsong Lo |
author_facet |
Jyi-Tsong Lo Jian-Min Jeng 鄭健民 |
author |
Jian-Min Jeng 鄭健民 |
spellingShingle |
Jian-Min Jeng 鄭健民 Study of DLC Field Emission Device Fabricated by Thick-Film Technology |
author_sort |
Jian-Min Jeng |
title |
Study of DLC Field Emission Device Fabricated by Thick-Film Technology |
title_short |
Study of DLC Field Emission Device Fabricated by Thick-Film Technology |
title_full |
Study of DLC Field Emission Device Fabricated by Thick-Film Technology |
title_fullStr |
Study of DLC Field Emission Device Fabricated by Thick-Film Technology |
title_full_unstemmed |
Study of DLC Field Emission Device Fabricated by Thick-Film Technology |
title_sort |
study of dlc field emission device fabricated by thick-film technology |
publishDate |
2004 |
url |
http://ndltd.ncl.edu.tw/handle/46232304983880974693 |
work_keys_str_mv |
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