| Summary: | 碩士 === 大同大學 === 機械工程學系(所) === 92 === With the rapid development of central operation technology in computer, to solve the thermal issue is increasingly hard. How to schedule an effective simulation plan to interpret the causes that affect the thermal issue directly, then improve the cooler machinery to keep the operation temperature of main components under their specifications is the main target of this thesis.
In this thesis, use the analysis software Flotherm 4.1 and tie in with the Taguchi method to schedule the simulation plan for discussing the 1U server. To analyze the factor effect on the temperature of main components from the planned simulation result, then scheme the local optimal design and estimate its effect. At last we do an experiment to test and verify the result. Finally, hope to bring up an effective proposal by any possible active solution to solve the thermal problem of next generation. Our target power is over 150W and its’ specification have to less than 70℃.
Making comparison between the final 1U server internal system analysis and the schedule simulation result of Taguchi orthogonal arrays, we have arrived at the following conclusions and recommendation.
1. A full and designate orthogonal arrays can decide the real control factor of quality characteristics. We propose to arrange all main factors with the fish-bone diagram mode and accept or reject them during design the orthogonal arrays.
2. The grid density directly affects the simulation result, especially the area around the main components (like blower, heat sink, CPU and so on). In this case, the result of remove the third system fan could not be manifested, if the density of the grids is not good enough.
3. Consideration was given to reduce the system resistance. The main signal factor is the collocation of fan duct and the blowers, whether to add a separation inside or not is important. The layout of chassis holes and system fans is also a major factor. To keep all components’ specifications, it is possible to raise the airflow of the main portion by excluding some minor one’s temperature.
4. Consideration was given to increase the area of heat dissipation. To add the fin number in the same space directly, it will raise the system resistance too. We recommend solving the thermal issue of CPU and North Bridge chipset together. Simulation comparison revealed that to add the fin length and cooperate with heat pipe would have great improvement in CPU temperature reduction.
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