Manufacturing Process Optimization of the IC Packaging Circles by the Extenics & six sigma method

• Main Authors: Chun - Lin Huang, 黃俊麟
• Other Authors: Shih-Hsing Chang
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/26916900194106074677

碩士 === 萬能科技大學 === 經營管理研究所 === 92 === The IC industry in Taiwan is to be the OEM model for other countries. The trend of the capacity value for manufacturing of our IC Packaging Circles still grows up. It is not only the important role in economic, but also be a leading position. Merely, the OEM model will be changing all the time. For the high quality assurance can adopt the changes, it will obviously lift the specific revenue and the ability of profit. The purpose of my research for the six sigma quality system (DMAIC -Define、Measure、Analysis、Improve、Control) based on the Extenics algorithm be a improving part of the six sigma process that manufacture process optimization of the IC packaging circles for the key moding process. Within ANOVA calculating that can get contribution rate gives the weight of key moding factors, it can bring down the subjectivism of the manufacturing process. The six sigma based on forward speaking to be a manufacturing process optimization and established the consistent quality system. Eventually, we use the six sigma quality system for one case study of the IC packaging factory that makes its key manufacturing process optimization. Our Contribution in manufacturing process optimization of the IC Packaging Circles by the Extenics & six sigma method is to set an example for the IC Packaging industries, and to meet the IC Packaging Circles requirements in future.