The influence of wafer quality characteristic on the performance of free recycled abrasive multi-wire sawing process
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 92 === Along with the development and progresses of the machine industry, and accompany with the technique that Taiwan recent years integrated circuit make into have promoted the realm of going to a micron class from the micron class, the development of the photolith...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47531532065202350698 |
| Summary: | 碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 92 === Along with the development and progresses of the machine industry, and accompany with the technique that Taiwan recent years integrated circuit make into have promoted the realm of going to a micron class from the micron class, the development of the photolithography, etching etc. in whole process that make into the technique has the prominent position.
The main purpose in this thesis is a research the slicing characteristic of used recycled abrasive to cutting silicon ingot and check the design programming of the method by the Taguchi methods, through the result of experience parameter to understanding the influence toward the silicon wafer quality characteristic at a free recycled abrasive multi-wire saw process at the present time.
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