Optimizing Process Parameters of the Hot Bar Soldering Technology through Application of the QFD and the Taguchi Method
碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 93 === This paper intends to combine the QFD (Quality Function Deployment) and the Taguchi method, which were applied to analyze the characteristics of the Hot Bar Soldering Process and to optimize its parameters, respectively, after this new process was first intro...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/46919471112452667077 |
| Summary: | 碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 93 === This paper intends to combine the QFD (Quality Function Deployment) and the Taguchi method, which were applied to analyze the characteristics of the Hot Bar Soldering Process and to optimize its parameters, respectively, after this new process was first introduced in an EMS company and the initial yield of quality was bad. The company produces a Gate Board which is transmitting vertical signals in TFT LCD modules by the Hot Bar Soldering Process. In the process, heat from the pulse heater is transferred to a hot bar and the FPC is soldered on a pad of PCB. In this research, we studied the key quality factors of the Hot Bar Soldering Process using the Quality Function Deployment methodology and controlled these factors by other specific quality control methods to achieve a quality improvement and to enable daily control. The QFD data show that the third ranked key factor which influences quality is the “optimal process parameters setting”. Hence we employed the Taguchi method to further study the optimal parameters of the Hot Bar Soldering Process. We selected strength of solder joints as the quality characteristics of the process output and chose factors which influence the strength of the solder joints for these experiments. The result showed that quality could be greatly improved, thus increasing the yield to a standard satisfying customers needs.
|
|---|