Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films

博士 === 逢甲大學 === 材料科學所 === 93 === FePt and FePt/Cu thin films were fabricated by magnetron sputtering on quartz substrates. Effects of thickness and annealing temperature on magnetic properties were studied. The thickness of FePt ranged from 10 nm to 200 nm. For single-layer FePt, the optimum conditi...

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Main Authors: Fu-Te Yuan, 袁輔德
Other Authors: Shih-Kun Chen
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/67824130196745014721
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spelling ndltd-TW-093FCU051590372015-10-13T10:34:09Z http://ndltd.ncl.edu.tw/handle/67824130196745014721 Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films 銅與金之頂層擴散對鐵鉑薄膜磁性質及微結構之影響 Fu-Te Yuan 袁輔德 博士 逢甲大學 材料科學所 93 FePt and FePt/Cu thin films were fabricated by magnetron sputtering on quartz substrates. Effects of thickness and annealing temperature on magnetic properties were studied. The thickness of FePt ranged from 10 nm to 200 nm. For single-layer FePt, the optimum condition of magnetic properties appeared at a thickness of 60 nm. The ordering parameter (K) increases with temperatures and reaches a maximum value 0.9 at annealing temperature of 800℃. The high K value is an important reason for the high coercivity. In the FePt (60 nm)/Cu (60 nm) thin films, we found that the maximum coercivity appeared as the sample was annealed at 400℃. In this condition, interfacial diffusion is mainly through the FePt grain boundary. For the higher annealing temperature, the volume diffusion took place. XRD patterns of FePt/Cu films showed that FePt and Cu extensively formed a ternary solid solution at higher annealing temperature (>500℃) which decreases the coercivity to a few hundreds of oersteds. The analyses of δM plots showed that the diffusion of Cu in FePt grain boundaries reduces the exchange coupling as the thin films was annealed at 400℃. In the FePt/Au thin films, we found that the coercivity increased dramatically with the annealing temperature. The maximum coercivity of 30 kOe appeared at the FePt (10 nm)/Au (60 nm) sample. From the results of XRD study, we learned that even at a very high temperature annealing, no volume diffusion can be found in both FePt and Au grains. The interdiffusion of FePt and Au also forms a nanocomposited microstructure consisting of FePt particles embedded in Au matrix. This microstructural modification also leads the reversal behavior changed from the domain wall motion to the nucleation control. Shih-Kun Chen 陳士堃 2005 學位論文 ; thesis 165 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 博士 === 逢甲大學 === 材料科學所 === 93 === FePt and FePt/Cu thin films were fabricated by magnetron sputtering on quartz substrates. Effects of thickness and annealing temperature on magnetic properties were studied. The thickness of FePt ranged from 10 nm to 200 nm. For single-layer FePt, the optimum condition of magnetic properties appeared at a thickness of 60 nm. The ordering parameter (K) increases with temperatures and reaches a maximum value 0.9 at annealing temperature of 800℃. The high K value is an important reason for the high coercivity. In the FePt (60 nm)/Cu (60 nm) thin films, we found that the maximum coercivity appeared as the sample was annealed at 400℃. In this condition, interfacial diffusion is mainly through the FePt grain boundary. For the higher annealing temperature, the volume diffusion took place. XRD patterns of FePt/Cu films showed that FePt and Cu extensively formed a ternary solid solution at higher annealing temperature (>500℃) which decreases the coercivity to a few hundreds of oersteds. The analyses of δM plots showed that the diffusion of Cu in FePt grain boundaries reduces the exchange coupling as the thin films was annealed at 400℃. In the FePt/Au thin films, we found that the coercivity increased dramatically with the annealing temperature. The maximum coercivity of 30 kOe appeared at the FePt (10 nm)/Au (60 nm) sample. From the results of XRD study, we learned that even at a very high temperature annealing, no volume diffusion can be found in both FePt and Au grains. The interdiffusion of FePt and Au also forms a nanocomposited microstructure consisting of FePt particles embedded in Au matrix. This microstructural modification also leads the reversal behavior changed from the domain wall motion to the nucleation control.
author2 Shih-Kun Chen
author_facet Shih-Kun Chen
Fu-Te Yuan
袁輔德
author Fu-Te Yuan
袁輔德
spellingShingle Fu-Te Yuan
袁輔德
Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films
author_sort Fu-Te Yuan
title Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films
title_short Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films
title_full Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films
title_fullStr Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films
title_full_unstemmed Effects of Top-layer Diffusion of Cu and Au on Magnetic Properties and Microstructure in FePt Thin Films
title_sort effects of top-layer diffusion of cu and au on magnetic properties and microstructure in fept thin films
publishDate 2005
url http://ndltd.ncl.edu.tw/handle/67824130196745014721
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