Warpage evaluation by a finite element method for 3D-Stacked BGA packages
碩士 === 國立成功大學 === 工程科學系專班 === 93 === A numerical investigation of 3D-Stacked BGA packages is conducted to evaluate package warpage during the assembly process by ANSYS. The effects of die thickness、substrate thickness、mold compound thickness and process temperature on warpage are studied so that...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98812400754217782912 |