Characteristics of Cu alloy thin films and their applications as the interconnect materials in integrated circuits
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 93 === In this study, the characteristics of Cu alloy thin films and their applications as the materials of interconnect in integrated circuits were explored. Thin films of pure Cu and Cu along with Ti, Ta, and Zr with two different concentrations were deposited...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18575489585537883346 |