| Summary: | 碩士 === 國立交通大學 === 機械工程系所 === 93 === Hot embossing technology is used to manufacture high precision, high quality, and high aspect ratio of polymer micro structures. Due to the differences of thermal expansion coefficient between polymer and mold insert, shrinking of polymer material in the cooling step may lead the mold cavities to press micro structures from both sides. In addition, because of it under the state of pressing, the stress concentration will occur in the root of micro structures, and the defect of rupturing will happen during the demolding step. In order to eliminate stress concentration and attain good shape-transformation, this research attempts to develop a MEMS systematic mold insert, which keeps the mold insert at a satisfactory high temperature while the mold is cooling. P type (110) silicon wafer, as a substrate, is used to produce conducted regions with desired resistance. Moreover, these conducted regions with suitable resistance are utilized as the heaters, which are charged an electric current to heat the mold insert in the cooling stage. Furthermore, effects of temperature and pressure on the resistance are investigated respectively to develop the temperature-sensing and pressure-sensing function on the mold insert.
The design of this MEMS systematic mold insert can also be easily applied to manufacturing a large area of intensive and high aspect ratio micro structures. It shows effective results in solving the problem of shrinkage on a large area when hot embossing is used.
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