| Summary: | 碩士 === 國立中山大學 === 企業管理學系研究所 === 93 === Because most of Taiwan semiconductor industry are (OEM; Original Equipment Manufacturer) and the major customers have two type: One is IDM which has own IC design, fab manufacturing, IC assembly and IC test, for example IBM,Inter…etc.And the other is IC design houses which only have IC design, and let fab manufacturing, IC assembly and IC test outsourcing, for example Media Tek, Etron...etc. In order to force on core technology, the company’s strategy is outsourcing and the outsourcing capacity will release to subcontractors. How to increase new package development performance is the major points to make sure subcontractors can get outsourcing capacity and it also can let company transfer from OEM to ODM.
New package development is the basic procedure and the core technology in the semiconductor industry. Due to the product become high risk, shorter life cycle time and faster technology innovation, it causes the company will be more competitive in the world. In order to keep growth, it’s very important to make sure the success of new package development. That’s reason why more and more company involve customers knowledge in the new package development to reduce uncertainty, shear financial risk and provide the key decision. Believe in the customer knowledge management, customer characteristic and market information are all affect the new product development performance.
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