A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection
碩士 === 國立中山大學 === 電機工程學系研究所 === 93 === Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal int...
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ndltd-TW-093NSYS54420572015-12-23T04:08:13Z http://ndltd.ncl.edu.tw/handle/62919600743374771861 A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection 可超寬頻抑制地彈雜訊之封裝級電源平面 Ting-Kuang Wang 王挺光 碩士 國立中山大學 電機工程學系研究所 93 Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal integrity (SI) problems, such as glitches or timing push-out of signal traces, but also increases the electromagnetic interference (EMI) in the high-speed digital circuits. With the design trends of digital circuits toward higher speed, low voltage level, smaller volume, the impact of GBN has become one of the most important issues that determine the performance of electronic products. Adding decoupling capacitors between the power and ground planes is a typical way to suppress the GBN. However, they are not effective at the frequencies higher than 600MHz due to their inherent lead inductance. Recently, a new idea for eliminating the GBN is proposed by designing electromagnetic bandgap (EBG) structure with high impedance surface (HIS) on the ground or power plane. Several new EBG power/ground plane designs have been proposed to broaden the stopband bandwidth for suppressing the GBN. However there are some drawbacks, such as high cost, large area occupation and complicated fabrication process. In this paper, we propose a novel Hybrid EBG power planes for PCB or package to suppress the GBN. Its extinctive behavior of broadband suppression of GBN (over 10GHz) is demonstrated experientially and numerically. Finally, we combine the periodic high-low dielectric material with the EBG power plane to control the position and bandwidth of stopband. Tzong-Lin Wu 吳宗霖 2005 學位論文 ; thesis 80 zh-TW |
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碩士 === 國立中山大學 === 電機工程學系研究所 === 93 === Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal integrity (SI) problems, such as glitches or timing push-out of signal traces, but also increases the electromagnetic interference (EMI) in the high-speed digital circuits. With the design trends of digital circuits toward higher speed, low voltage level, smaller volume, the impact of GBN has become one of the most important issues that determine the performance of electronic products.
Adding decoupling capacitors between the power and ground planes is a typical way to suppress the GBN. However, they are not effective at the frequencies higher than 600MHz due to their inherent lead inductance. Recently, a new idea for eliminating the GBN is proposed by designing electromagnetic bandgap (EBG) structure with high impedance surface (HIS) on the ground or power plane. Several new EBG power/ground plane designs have been proposed to broaden the stopband bandwidth for suppressing the GBN. However there are some drawbacks, such as high cost, large area occupation and complicated fabrication process.
In this paper, we propose a novel Hybrid EBG power planes for PCB or package to suppress the GBN. Its extinctive behavior of broadband suppression of GBN (over 10GHz) is demonstrated experientially and numerically. Finally, we combine the periodic high-low dielectric material with the EBG power plane to control the position and bandwidth of stopband.
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author2 |
Tzong-Lin Wu |
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Tzong-Lin Wu Ting-Kuang Wang 王挺光 |
author |
Ting-Kuang Wang 王挺光 |
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Ting-Kuang Wang 王挺光 A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection |
author_sort |
Ting-Kuang Wang |
title |
A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection |
title_short |
A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection |
title_full |
A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection |
title_fullStr |
A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection |
title_full_unstemmed |
A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection |
title_sort |
package-level power plane with ultra-wide band ground bounce noise rejection |
publishDate |
2005 |
url |
http://ndltd.ncl.edu.tw/handle/62919600743374771861 |
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