A Package-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection
碩士 === 國立中山大學 === 電機工程學系研究所 === 93 === Transient current surges resulted from the simultaneous switching of output buffers in the high-speed digital circuits can induce significant ground bounce noise (GBN) on the chip, package, and printed circuit board (PCB). The GBN not only causes the signal int...
Main Authors: | Ting-Kuang Wang, 王挺光 |
---|---|
Other Authors: | Tzong-Lin Wu |
Format: | Others |
Language: | zh-TW |
Published: |
2005
|
Online Access: | http://ndltd.ncl.edu.tw/handle/62919600743374771861 |
Similar Items
-
Modeling and Design of Stopband Enhancement Electromagnetic bandgap Structure for Power/Ground Bounce Noise Suppression in Advanced Packages
by: Ting-Kuang Wang, et al.
Published: (2009) -
A Open S-Bridged Power Plane With Ultra Wideband Suppression of Ground Bounce Noise
by: Meng-Huan Lu, et al.
Published: (2014) -
Study of Wide Band Electromagnetic Bandgap Structure for Ground Bounce Noise Suppression in Package-level
by: Ta-Cheng Chin, et al.
Published: (2010) -
New Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise
by: Ching-Wen Wang, et al.
Published: (2014) -
A New Broadband Electromagnetic Band-gap (EBG) PowerPlanes with High Suppression of Ground Bounce Noise
by: Sin-Min Chang, et al.
Published: (2004)