Thermal Performance of Heat Sink With Embedded Heat Pipe Using Thermal Resistance Method

• Main Authors: Ren-Hao Kang, 康仁豪
• Other Authors: 陳希立
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/26383719284163517678

碩士 === 國立臺灣大學 === 機械工程學研究所 === 93 === In recent years, the electronic devices and components have better performance constantly. With the increasing performance, the heat generation of the electronic devices and components also increases. Therefore, looking for more effective cooling method plays an important role. The embedded heat-pipe cooling module in this investigation is designed to solve the foregoing thermal problem. This investigation successfully establishes an overall theoretical model for the embedded heat-pipe cooling module by adopting the thermal resistance’s analysis and the performance’s experiment, and provides the follow-up research a basis. From the experimental results, the performance of this cooling module is affected by the performance of heat-pipe. When the input power is 140W, this cooling has a best overall thermal resistance 0.267℃/W.