| Summary: | 碩士 === 淡江大學 === 機械與機電工程學系碩士班 === 93 === The study investigates thermal performance of vapor chamber heat spreaders by numerical method. Two-dimensional flow and energy equations are solved in the vapor core, along with conduction in the wall. Numerical simulation is studied with the software ANSYS 9.0 to predict the temperature distribution on a 4cm x 0.2cm chamber area with variation in material and heat source size of the spreader.
With comparison of the copper, aluminum, and silicon, result shows that wall thermal conductivity is a major factor in such thin, flat spreaders. The spreader performance also degrades with degrade in heat source size due to the heat centralization and uneven temperature distribution. In addition to heat transmission, vapor chamber can also bring heat to cooling surface, and heat sink effectively, and improve capability of heat dissipation.
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