| Summary: | 碩士 === 大同大學 === 機械工程學系(所) === 93 === In recent years, the electronic equipment is continuously developing in shrinking its size and turning high performance, this trend urges the heat sink of electronics device to become gradually important. So it develops many different types of heat-lost equipment. So this thesis makes use of the type of heat pipe to design a vapor chamber heat sink, it can do very quickly and high latent heat releasing of heat transfer characteristic at low cost and the highest safety considering. It can use at a traditional aluminum heat sink to promote heat transfer efficiency of a usual heat sink, it can become a so-called heat transferring superconductor to manage the heat transfer requirement of the higher-energy electronic element.
This thesis uses the usual P4 heat sink of the P.C. at the business situation, and manufactures it to become a vapor chamber heat sink with a chamber at the heat sink’s underneath. This thesis proceeds the experiment and discussing to counter with the filling capacity of the working fluid, the difference of the filling fluid and the influence of the heat sink efficiency with adding Nanofluid. From the experiment data shows that when filling capacity at 50％, it has the best heat transfer efficiency, but because when it at 20 milliliter, 25 milliliter and 30 milliliter, its temperature change is much bigger, so we experiment CPU’s temperature change at 24 milliliter and 26 milliliter, the result shows that the measuring temperature at 25 milliliter is the best. And the Methanol’s filled is useful to heat transfer than the water’s filled.
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