Three-dimensional measurement of reflow solder pastes using phase unwrapping techniques in a phase shift system
碩士 === 元智大學 === 工業工程與管理學系 === 93 === Reflow process is the back-end procedure in surface-mounting-technology (SMT) manufacturing. As the design of electronic products has been trending light, thin, and multi-function, precise 3D inspection has become more and more important for increasingly small re...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/10059187618903788012 |